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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics
Daisuke Tomotoshi, Hideya Kawasaki
Nanomaterials (2020) Vol. 10, Iss. 9, pp. 1689-1689
Open Access | Times Cited: 83

Showing 1-25 of 83 citing articles:

A Review on Printed Electronics: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts
Jenny Wiklund, Alp Karakoç, Toni Palko, et al.
Journal of Manufacturing and Materials Processing (2021) Vol. 5, Iss. 3, pp. 89-89
Open Access | Times Cited: 142
Facile microwave-mediated green synthesis of non-toxic copper nanoparticles using Citrus sinensis aqueous fruit extract and their antibacterial potentials
Israt Jahan, Fatih Erci, İbrahim Işıldak
Journal of Drug Delivery Science and Technology (2020) Vol. 61, pp. 102172-102172
Closed Access | Times Cited: 93
Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics
Zheng Li, Shuquan Chang, Saurabh Khuje, et al.
ACS Nano (2021) Vol. 15, Iss. 4, pp. 6211-6232
Closed Access | Times Cited: 85
Copper inks for printed electronics: a review
Xianghui Zeng, Pei He, Minglu Hu, et al.
Nanoscale (2022) Vol. 14, Iss. 43, pp. 16003-16032
Closed Access | Times Cited: 52
Recent Advances in Carbon Nanotube Utilization in Perovskite Solar Cells: A Review
Usman Asghar, Muhammad Azam Qamar, Othman Hakami, et al.
Micromachines (2024) Vol. 15, Iss. 4, pp. 529-529
Open Access | Times Cited: 9
A novel Cu@Ag nano paste with low porosity for rapidly sintering in air condition
Kaifeng Wang, Jiayue Wen, Jiayun Feng, et al.
Materials Characterization (2024) Vol. 209, pp. 113762-113762
Closed Access | Times Cited: 8
Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
Yulei Yuan, Houya Wu, Junjie Li, et al.
Applied Surface Science (2021) Vol. 570, pp. 151220-151220
Closed Access | Times Cited: 44
A Review on Recyclable Printed Electronics: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts
Jenny Wiklund, Alp Karakoç, Toni Palko, et al.
(2021)
Open Access | Times Cited: 41
Silver nanoparticles (AgNPs) as a metal nano-therapy: possible mechanisms of antiviral action against COVID-19
Najlaa S. Al‐Radadi, Ahmed M. Abu‐Dief
Inorganic and Nano-Metal Chemistry (2022) Vol. 54, Iss. 8, pp. 709-727
Closed Access | Times Cited: 32
Development of Eco-Efficient Smart Electronics for Anticounterfeiting and Shock Detection Based on Printable Inks
Edis Glogic, Romain Futsch, Victor Thénot, et al.
ACS Sustainable Chemistry & Engineering (2021) Vol. 9, Iss. 35, pp. 11691-11704
Open Access | Times Cited: 37
In-situ reduced non-oxidized copper nanoparticles in nanocomposites with extraordinary high electrical and thermal conductivity
C. Muhammed Ajmal, Aby Paul Benny, Wonjae Jeon, et al.
Materials Today (2021) Vol. 48, pp. 59-71
Closed Access | Times Cited: 34
Laser sintering of Cu particle-free inks for high-performance printed electronics
Nihesh Mohan, Juan Ignacio Ahuir‐Torres, Hiren R. Kotadia, et al.
npj Flexible Electronics (2025) Vol. 9, Iss. 1
Open Access
PathoSense: a rapid optical aptasensing platform for monitoring Staphylococcus aureus in milk
Najeeb Ullah, Tracy Ann Bruce‐Tagoe, George Adu Asamoah, et al.
Journal of Chemical Technology & Biotechnology (2025)
Closed Access
Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging
Limin Ma, Ziyi Lu, Qiang Jia, et al.
Journal of Electronic Materials (2024) Vol. 53, Iss. 6, pp. 2988-2998
Closed Access | Times Cited: 4
Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics
Zabihollah Ahmadi, Aarsh Patel, Curtis Hill, et al.
ACS Applied Electronic Materials (2024) Vol. 6, Iss. 5, pp. 3933-3940
Closed Access | Times Cited: 4
Integrating High-Performance Flexible Wires with Strain Sensors for Wearable Human Motion Detection
Pucheng Wu, Hu He
(2024)
Open Access | Times Cited: 4
In Situ Rheoimpedance and Thermogravimetry–Differential Thermal Analysis of Copper-Based Conductive Inks for High-Oxidation-Resistant Performance
Ryousuke Ishikawa, Yuki Kawata, Hideya Kawasaki
ACS Applied Electronic Materials (2025)
Closed Access
Flexible multifunctional sensor for wound monitoring
Hao Chai, Yang Ye, Zhendong Liu, et al.
The European Physical Journal Special Topics (2025)
Closed Access
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
Wei Liu, Hung Wang, Kuo-Shuo Huang, et al.
Journal of the Taiwan Institute of Chemical Engineers (2021) Vol. 125, pp. 394-401
Closed Access | Times Cited: 25
Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures
Daisuke Tomotoshi, Rika Oogami, Hideya Kawasaki
ACS Applied Materials & Interfaces (2021) Vol. 13, Iss. 17, pp. 20906-20915
Closed Access | Times Cited: 23
Size-controlled nanoscale octahedral HKUST-1 as an enhanced catalyst for oxidative conversion of vanillic alcohol: The mediating effect of polyvinylpyrrolidone
Bing-Cheng Li, Jia-Yin Lin, Jechan Lee, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2021) Vol. 631, pp. 127639-127639
Closed Access | Times Cited: 23
Copper Ion Inks Capable of Screen Printing and Intense Pulsed-Light Sintering on PET Substrates
Soo Min Song, Sungmin Cho
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 4, pp. 1882-1890
Closed Access | Times Cited: 18
Copper Nanoplates for Printing Flexible High-Temperature Conductors
Aaron Sheng, Saurabh Khuje, Jian Yu, et al.
ACS Applied Nano Materials (2022) Vol. 5, Iss. 3, pp. 4028-4037
Closed Access | Times Cited: 18
Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
Wanli Li, Lingying Li, Fei Li, et al.
ACS Applied Materials & Interfaces (2022) Vol. 14, Iss. 6, pp. 8146-8156
Closed Access | Times Cited: 17
Molecular copper decomposition ink for printable electronics
Aaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
Chemical Communications (2022) Vol. 58, Iss. 68, pp. 9484-9487
Closed Access | Times Cited: 16
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