OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks
Cadmus Yuan, Qinghua Su, Kuo‐Ning Chiang
Materials (2023) Vol. 16, Iss. 14, pp. 4922-4922
Open Access | Times Cited: 8
Cadmus Yuan, Qinghua Su, Kuo‐Ning Chiang
Materials (2023) Vol. 16, Iss. 14, pp. 4922-4922
Open Access | Times Cited: 8
Showing 8 citing articles:
Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model
Hsien‐Chie Cheng, Ji-Yuan Syu, He-Hong Wang, et al.
IEEE Transactions on Device and Materials Reliability (2024) Vol. 24, Iss. 1, pp. 142-153
Closed Access | Times Cited: 6
Hsien‐Chie Cheng, Ji-Yuan Syu, He-Hong Wang, et al.
IEEE Transactions on Device and Materials Reliability (2024) Vol. 24, Iss. 1, pp. 142-153
Closed Access | Times Cited: 6
Structural identifiability of parameters of Anand material model
Jaroslav Rojíček, Jakub Cienciala, Martin Fusek
Scientific Reports (2025) Vol. 15, Iss. 1
Open Access
Jaroslav Rojíček, Jakub Cienciala, Martin Fusek
Scientific Reports (2025) Vol. 15, Iss. 1
Open Access
On the validity of rainflow counting-based lifetime assessment for power electronics assembly
Dawei Zhao, S Letz, J. Leib, et al.
Microelectronics Reliability (2025) Vol. 168, pp. 115651-115651
Open Access
Dawei Zhao, S Letz, J. Leib, et al.
Microelectronics Reliability (2025) Vol. 168, pp. 115651-115651
Open Access
Comparison of Tensile and Creep Properties of SAC305 and SACX0807 at Room Temperature with DIC Application
Zbyněk Paška, Radim Halama, Petr Dymáček, et al.
Applied Sciences (2024) Vol. 14, Iss. 2, pp. 604-604
Open Access | Times Cited: 3
Zbyněk Paška, Radim Halama, Petr Dymáček, et al.
Applied Sciences (2024) Vol. 14, Iss. 2, pp. 604-604
Open Access | Times Cited: 3
Reliability and thermal fatigue life prediction of solder joints using nanoindentation
Jie Cao, Xin Lan, Xiao Cui, et al.
Materials Today Communications (2024) Vol. 39, pp. 109240-109240
Closed Access | Times Cited: 2
Jie Cao, Xin Lan, Xiao Cui, et al.
Materials Today Communications (2024) Vol. 39, pp. 109240-109240
Closed Access | Times Cited: 2
AI-assisted Design for Reliability: Review and Perspectives
Cadmus Yuan, Sangjo Jong, W.D. van Driel
(2024), pp. 1-12
Closed Access | Times Cited: 1
Cadmus Yuan, Sangjo Jong, W.D. van Driel
(2024), pp. 1-12
Closed Access | Times Cited: 1
In Silico Benchmarking of Fatigue Life Estimation Models for Passive SMD Solder Joints Under Thermal Cycling
Antal Bakonyi, Gusztáv Fekete, Ambrus Zelei
Applied Mechanics (2024) Vol. 5, Iss. 4, pp. 877-907
Open Access
Antal Bakonyi, Gusztáv Fekete, Ambrus Zelei
Applied Mechanics (2024) Vol. 5, Iss. 4, pp. 877-907
Open Access
Reliability and Thermal Fatigue Life Prediction of Solder Joints Using Nanoindentation
Jie Cao, Xin Lan, Xiao Cui, et al.
(2023)
Closed Access | Times Cited: 1
Jie Cao, Xin Lan, Xiao Cui, et al.
(2023)
Closed Access | Times Cited: 1
