OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock
Zhidai Zhou, Jiahuan Chen, Yu Chen, et al.
Coatings (2023) Vol. 13, Iss. 3, pp. 572-572
Open Access | Times Cited: 10

Showing 10 citing articles:

A machine learning and finite element simulation-based void inspection for higher solder joint reliability
Kaiyuan Chen, Yu Zhang, Guang Cheng, et al.
Microelectronics Reliability (2024) Vol. 154, pp. 115323-115323
Closed Access | Times Cited: 4

Research on the Damage Characteristics of a UAV Flight Control System Irradiated by a Continuous Laser
Le Liu, Chengyang Xu, Sheng Cai, et al.
Aerospace (2025) Vol. 12, Iss. 2, pp. 161-161
Open Access

Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element
Azman Jalar, Ellys Lim, Maria Abu Bakar, et al.
Journal of Failure Analysis and Prevention (2025)
Closed Access

Review on the impact of marine environment on the reliability of electronic packaging materials
F C Lang, Zhenrui Zhou, Jia Liu, et al.
Frontiers in Materials (2025) Vol. 12
Open Access

A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
Norliza Ismail, Wan Yusmawati Wan Yusoff, Azuraida Amat, et al.
Defence Technology (2024) Vol. 41, pp. 134-158
Open Access | Times Cited: 1

Crystallographic changes and mechanical Performances of SnAg2.4/Cu Pillars during thermal shocks in a large temperature range
Xiangyu Chen, Xinyi Jing, Keyu Luo, et al.
Engineering Failure Analysis (2024), pp. 109125-109125
Closed Access | Times Cited: 1

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components
Adrian Pietruszka, Paweł Górecki, Agata Skwarek
Soldering and Surface Mount Technology (2024) Vol. 36, Iss. 4, pp. 230-238
Closed Access

Monitoring Industrial Systems Using ESP-NOW Protocol with Mesh and Ad Hoc Network
Lucas Henrique Brito Santos, Eduardo José Monteiro Da Silva, Aleqssandro Alexandre de Oliveira Farias, et al.
(2023), pp. 559-566
Closed Access

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