OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration
Xiaodi Dong, Baoquan Wan, Jun‐Wei Zha
Chemical Reviews (2024) Vol. 124, Iss. 12, pp. 7674-7711
Closed Access | Times Cited: 16

Showing 16 citing articles:

High-temperature energy storage capability of flexible polyimide film incorporated with compatible covalent organic framework
Lianlian Chen, Dongdong Zheng, Fuxing Zhai, et al.
Journal of Power Sources (2025) Vol. 631, pp. 236204-236204
Closed Access

Physical evolution mechanism of polyimide/fluorinated graphene composite insulating materials under extreme conditions
Song Bi, Tong Zhao, Jiying Tuo, et al.
Progress in Organic Coatings (2025) Vol. 200, pp. 109065-109065
Closed Access

In Situ Preparation of Siloxane-Linked Colorless Polyimides with Low Dielectric Constant
Hongzhu Chen, Fangyu Li, Jiayu Xiong, et al.
ACS Applied Polymer Materials (2025)
Closed Access

Low-dielectric polyimide resins with improved processability and thermal properties
G. F. Hong, Meng Xiangsheng, Aimin Chen, et al.
High Performance Polymers (2025)
Closed Access

Designs and recent progress of intrinsic low dielectric polyimide films
Wenjing Dou, Tengteng Li, Xinping Zhang, et al.
Progress in Organic Coatings (2024) Vol. 196, pp. 108708-108708
Closed Access | Times Cited: 3

Achieving low dielectric constant and high thermal conductivity polymer composites by using larger POSS functionalized boron nitride nanosheets
Ming-Xi Nie, Jian Wang, Qin Zhang, et al.
Journal of Materials Chemistry A (2024) Vol. 12, Iss. 36, pp. 24214-24225
Closed Access | Times Cited: 2

Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging
Feng Zhang, Peng Li, Lin Wang, et al.
European Polymer Journal (2024) Vol. 220, pp. 113404-113404
Closed Access | Times Cited: 1

Molecular dynamics simulation of the thermal conductivity and dielectric properties of PI/FG composites
Song Bi, Tong Zhao, Jiying Tuo, et al.
Surfaces and Interfaces (2024), pp. 105569-105569
Closed Access | Times Cited: 1

Nacre-Inspired Hierarchical Bionic Substrate for Enhanced Thermal and Mechanical Stability in Flexible Applications
Baichuan Sun, Gaobin Xu, Cunhe Guan, et al.
Sensors and Actuators A Physical (2024) Vol. 378, pp. 115832-115832
Closed Access

Flexible low dielectric permittivity paper as a disposable substrate for centimeter wave patch antennas
Fukun Niu, Rong Yu, Yibo Zhang, et al.
Cell Reports Physical Science (2024), pp. 102253-102253
Open Access

Dual covalent bond induced high thermally conductive polyimide composite films based on CNT@CN complex filler
Fan Wang, Xiaodi Dong, Guangyi Liu, et al.
Composites Science and Technology (2024) Vol. 259, pp. 110963-110963
Closed Access

Research on the properties of low-k films grafted on Cu (111) surface via electrochemical reduction of aryl diazonium salts
Liang Cao, Xiaohui Guo, Ming Li
Applied Surface Science (2024), pp. 161959-161959
Closed Access

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