OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Three anionic surfactants for corrosion inhibition in cobalt CMP: Research on validity and mechanism
Fangyuan Wang, Shihao Zhang, Baimei Tan, et al.
Surfaces and Interfaces (2024) Vol. 47, pp. 104202-104202
Closed Access | Times Cited: 7

Showing 7 citing articles:

A COMPREHENSIVE REVIEW ON ANTICORROSIVE BEHAVIOUR OF SURFACTANTS ACROSS DIVERSE METALS USING MULTIPLE TECHNIQUES: CURRENT INSIGHTS AND FUTURE HORIZONS
Pavithra, Namitha Kedimar, Suma A. Rao
Chemical Engineering Journal Advances (2024), pp. 100645-100645
Open Access | Times Cited: 2

The effect of alkyl chain on the corrosion inhibition of benzyldimethylammonium chloride in acidic environments
Hanhong Zhu, Lincai Peng, Shuqin Zhang, et al.
Journal of Molecular Liquids (2024), pp. 126051-126051
Closed Access | Times Cited: 2

Analysis, Identification, and Application of Distribution of Relaxation Times in CMP Slurry
wenhaoyu li, Baohong Gao, Jinxiang Huo, et al.
Electrochimica Acta (2024), pp. 145052-145052
Closed Access | Times Cited: 1

Effect of butanedione oxime, 3-mercapto-2-propanesulfonate, and histidine on growth and magnetic properties of electrodeposited cobalt on copper substrate
Wei Cao, Zhengwang Zhu, Qinyuan Li, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 35, Iss. 36
Closed Access

Study of the impact of flake Al2O3 abrasive and N-n-Butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers
Zhanjie Du, Ru Wang, Xuhua Chen, et al.
Surfaces and Interfaces (2024), pp. 105626-105626
Closed Access

Effect of novel non-inhibitor slurry on chemical mechanical polishing properties of copper interconnect copper film based on experiments and theoretical calculations
Chao He, Xinhuan Niu, Jianghao Liu, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2024), pp. 135457-135457
Closed Access

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