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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw
Youkang Yin, Yufei Gao, Liyuan Wang, et al.
Solar Energy (2021) Vol. 216, pp. 245-258
Closed Access | Times Cited: 46

Showing 1-25 of 46 citing articles:

A systematic review of precision mechanical machining processes for monocrystalline silicon based on modeling and simulation
Hongyan Wang, Mei Bai, Yin Wu, et al.
The International Journal of Advanced Manufacturing Technology (2025)
Closed Access | Times Cited: 1
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon
Ansheng Li, Shunchang Hu, Yu Zhou, et al.
Micromachines (2023) Vol. 14, Iss. 8, pp. 1512-1512
Open Access | Times Cited: 18
A critical review on the fracture of ultra-thin photovoltaics silicon wafers
Dameng Cheng, Yufei Gao
Solar Energy Materials and Solar Cells (2024) Vol. 274, pp. 112999-112999
Closed Access | Times Cited: 6
Surface/subsurface damage mechanisms and inhibition strategies in machining of hard and brittle materials: a systematic review
Yanhao Huo, Ying Niu, Zhipeng Sun, et al.
Surfaces and Interfaces (2024), pp. 105088-105088
Closed Access | Times Cited: 6
A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials
Eyob Messele Sefene, Chao‐Chang A. Chen, Yueh-Hsun Tsai
Journal of Manufacturing Processes (2024) Vol. 131, pp. 1466-1497
Closed Access | Times Cited: 6
Multi-objective optimization of energy consumption, surface roughness, and material removal rate in diamond wire sawing for monocrystalline silicon wafer
Eyob Messele Sefene, Chao-Chang Arthur Chen
The International Journal of Advanced Manufacturing Technology (2023) Vol. 129, Iss. 5-6, pp. 2563-2576
Open Access | Times Cited: 14
Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry
Jian Qiu, Xiaofei Li, Renpeng Ge, et al.
Wear (2021) Vol. 488-489, pp. 204186-204186
Closed Access | Times Cited: 32
Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing
Xinying Li, Yufei Gao, Runtao Liu, et al.
Engineering Fracture Mechanics (2022) Vol. 266, pp. 108391-108391
Closed Access | Times Cited: 19
Study on subsurface microcrack damage depth of diamond wire as-sawn sapphire crystal wafers
Zhenfeng Zhu, Yufei Gao, Xing-Chun Zhang
Engineering Fracture Mechanics (2023) Vol. 287, pp. 109347-109347
Closed Access | Times Cited: 12
Experimental study on the formation mechanism of saw marks in wire sawing
Zhiyuan Lai, Xinjiang Liao, Hao Yang, et al.
International Journal of Mechanical Sciences (2023) Vol. 265, pp. 108894-108894
Closed Access | Times Cited: 11
Processing quality prediction and multi-objective optimization of polysilicon wire-EDM
Hongming Gao, Yadong Gong, R. Zhu, et al.
Materials Science in Semiconductor Processing (2025) Vol. 192, pp. 109462-109462
Open Access
Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle
Youkang Yin, Yufei Gao, Chunfeng Yang
Ceramics International (2021) Vol. 47, Iss. 19, pp. 26627-26634
Closed Access | Times Cited: 26
Image-processing-based model for the characterization of surface roughness and subsurface damage of silicon wafer in diamond wire sawing
Shenxin Yin, Huapan Xiao, Heng Wu, et al.
Precision Engineering (2022) Vol. 77, pp. 263-274
Closed Access | Times Cited: 17
A material removal coefficient for diamond wire sawing of silicon
Florian Wallburg, Meinhard Kuna, Michael Budnitzki, et al.
Wear (2022) Vol. 504-505, pp. 204400-204400
Closed Access | Times Cited: 17
Preparation and performance study of electroplated Ni–W/diamond ultrathin dicing blades
Lan Zhang, Hongyang Yu, Huizhong Ma
Materials Science in Semiconductor Processing (2024) Vol. 175, pp. 108280-108280
Closed Access | Times Cited: 3
A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon
Ansheng Li, Hongyan Wang, Shunchang Hu, et al.
Micromachines (2024) Vol. 15, Iss. 8, pp. 1041-1041
Open Access | Times Cited: 3
Advance of Sustainable Energy Materials: Technology Trends for Silicon-Based Photovoltaic Cells
Mladen Bošnjaković
Sustainability (2024) Vol. 16, Iss. 18, pp. 7962-7962
Open Access | Times Cited: 3
Fabrication of high aspect ratio ceramic micro-channel in diamond wire sawing as catalyst support used in micro-reactor for hydrogen production
Xinying Li, Dongbi Fu, Wenjun Xu, et al.
International Journal of Hydrogen Energy (2022) Vol. 47, Iss. 83, pp. 35123-35135
Closed Access | Times Cited: 15
Development of ceramic-based 3D staggered microchannel catalyst support used in MSR microreactor for hydrogen production
Dongbi Fu, Xinying Li, Xinning Zhu, et al.
International Journal of Hydrogen Energy (2023) Vol. 49, pp. 680-695
Closed Access | Times Cited: 8
Fracture probability of PV mono-Si wafers in diamond wire slicing due to coupling of capillary adhesion bending stress and sawing stress
Dameng Cheng, Yufei Gao
Materials Science in Semiconductor Processing (2023) Vol. 169, pp. 107880-107880
Closed Access | Times Cited: 8
Analytical prediction of subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted wire sawing
Yan Wang, Tianqi Bai, Li Shu, et al.
The International Journal of Advanced Manufacturing Technology (2024) Vol. 133, Iss. 5-6, pp. 2445-2460
Closed Access | Times Cited: 2
Fracture strength analysis of large-size and thin photovoltaic monocrystalline silicon wafers
Dameng Cheng, Yufei Gao, Guanzheng Li
Engineering Fracture Mechanics (2024) Vol. 310, pp. 110523-110523
Closed Access | Times Cited: 2
Anti-reflection effect of large-area ZnO nano-needle array on multi-crystalline silicon solar cells
Meihuizi Wang, Haiyan He, Chunhui Shou, et al.
Materials Science in Semiconductor Processing (2021) Vol. 138, pp. 106299-106299
Closed Access | Times Cited: 16
Study on surface integrity and ductile cutting of PV polycrystalline silicon and wear mechanisms of electroplated diamond wire
Erick Cardoso Costa, Caroline Piesanti dos Santos, Vinícius Almeida Carvalho, et al.
The International Journal of Advanced Manufacturing Technology (2022) Vol. 122, Iss. 3-4, pp. 1539-1553
Closed Access | Times Cited: 12
Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths
Liang Lie, Shujuan Li, Kehao Lan, et al.
Micromachines (2023) Vol. 14, Iss. 6, pp. 1275-1275
Open Access | Times Cited: 6
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