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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Fatigue of metals at nanoscale: Metal thin films and conductive interconnects for flexible device application
Xue-Mei Luo, Bin Zhang, GuangPing Zhang
Nano Materials Science (2019) Vol. 1, Iss. 3, pp. 198-207
Open Access | Times Cited: 29

Showing 1-25 of 29 citing articles:

Bending Setups for Reliability Investigation of Flexible Electronics
Rafat Saleh, Maximilian Barth, Wolfgang Eberhardt, et al.
Micromachines (2021) Vol. 12, Iss. 1, pp. 78-78
Open Access | Times Cited: 50
An Anti‐Fatigue Design Strategy for 3D Ribbon‐Shaped Flexible Electronics
Xu Cheng, Fan Zhang, Renheng Bo, et al.
Advanced Materials (2021) Vol. 33, Iss. 37
Closed Access | Times Cited: 43
Micro-structural aspects of fatigue crack propagation in atomistic-scale via the molecular dynamics analysis
R. Yasbolaghi, A.R. Khoei
Engineering Fracture Mechanics (2019) Vol. 226, pp. 106848-106848
Closed Access | Times Cited: 52
High Yield Transfer of Clean Large-Area Epitaxial Oxide Thin Films
Bowen Zhang, Chao Yun, Judith L. MacManus‐Driscoll
Nano-Micro Letters (2021) Vol. 13, Iss. 1
Open Access | Times Cited: 33
Assessing the fracture and fatigue resistance of nanostructured thin films
L. Zauner, Rainer Hahn, E. Aschauer, et al.
Acta Materialia (2022) Vol. 239, pp. 118260-118260
Open Access | Times Cited: 20
Mechanisms of Stress Generation in Thin Films and Coatings
А. Р. Шугуров, А. В. Панин
Technical Physics (2020) Vol. 65, Iss. 12, pp. 1881-1904
Closed Access | Times Cited: 29
The effects of interlayer size and crystallinity on fatigue behavior of Cu/X (X= cr, amorphous CuZr) bilayers
Yun Xia, Y.Q. Wang, Kai Wu, et al.
Materials Science and Engineering A (2024) Vol. 897, pp. 146368-146368
Closed Access | Times Cited: 2
Dislocation Evolution in Cyclic‐Loaded Cu Nanopillars with Different Configurations
Xiyao Li, Zhiyu Zhao, Zhenghao Zhang, et al.
Small (2024)
Open Access | Times Cited: 2
Dynamic response and failure mechanisms of a laser-fabricated flexible thin film strain gauge
Ningyue Mao, Pablo D. Enrique, Albert I. H. Chen, et al.
Sensors and Actuators A Physical (2022) Vol. 342, pp. 113655-113655
Closed Access | Times Cited: 10
Combinatorial experiments for discovering Al-C thin films with high strength and ductility
Injong Oh, Hojang Kim, Hansol Son, et al.
International Journal of Plasticity (2023) Vol. 161, pp. 103515-103515
Closed Access | Times Cited: 5
Fatigue tolerance of nanostructured Cu/interlayer bilayers: Tuned by heterogeneous interface
Yun Xia, Zhuocheng Xie, Jiadong Zuo, et al.
Scripta Materialia (2023) Vol. 234, pp. 115563-115563
Closed Access | Times Cited: 4
Influence of thermal annealing on the microstructure evolution, fracture and fatigue behavior of nanocrystalline Cu films
Yun Xia, Jiadong Zuo, Chao Yang, et al.
Materials Today Communications (2023) Vol. 36, pp. 106793-106793
Closed Access | Times Cited: 4
New Solution of the Grain Boundary Grooving Problem in Polycrystalline Thin Films when Evaporation and Diffusion meet in Power Electronic Devices
Tayssir Hamieh, Ali Ibrahim, Zoubir Khatir
(2024)
Open Access | Times Cited: 1
Hydrogen Sensor with a Thick Catalyst Layer Anchored on Polyimide Film
Gustavo Panamá, Hye‐One Lee, Joongmyeon Bae, et al.
Advanced Materials Technologies (2024) Vol. 9, Iss. 20
Closed Access | Times Cited: 1
Flexible distributed Bragg reflectors as optical outcouplers for OLEDs based on a polymeric anode
Carmela Tania Prontera, Marco Pugliese, Roberto Giannuzzi, et al.
Journal of Information Display (2020) Vol. 22, Iss. 1, pp. 39-47
Open Access | Times Cited: 10
Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics
Yujia Yang, Bin Zhang, H.Y. Wan, et al.
Materials Science and Engineering A (2020) Vol. 792, pp. 139786-139786
Closed Access | Times Cited: 9
Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications
Honglei Chen, Xue-Mei Luo, Dong Wang, et al.
Journal of Material Science and Technology (2021) Vol. 89, pp. 107-113
Closed Access | Times Cited: 8
Механизмы возникновения напряжений в тонких пленках и покрытиях
А.Р. Шугуров, А.В. Панин
Журнал технической физики (2020) Vol. 90, Iss. 12, pp. 1971-1971
Open Access | Times Cited: 4
Size effect on stretchability of Cu films on wrinkled polydimethylsiloxane substrates
Kai Wu, D.K. Zhang, Ting Zhu, et al.
Thin Solid Films (2021) Vol. 742, pp. 139033-139033
Closed Access | Times Cited: 4
Transfer printing of metal films
Kaihao Zhang
Elsevier eBooks (2024), pp. 369-418
Closed Access
A New Solution to the Grain Boundary Grooving Problem in Polycrystalline Thin Films When Evaporation and Diffusion Meet in Power Electronic Devices
Tayssir Hamieh, Ali Ibrahim, Zoubir Khatir
Micromachines (2024) Vol. 15, Iss. 6, pp. 700-700
Open Access
Mechanically Robust, Inkjet-Printable Polymer Nanocomposites with Hybrid Gold Nanoparticles and Metal-like Conductivity
Michael A. H. Klos, Lola González‐García, Tobias Kraus
ACS Applied Materials & Interfaces (2024) Vol. 16, Iss. 24, pp. 31576-31585
Closed Access
Introduction to flexible electronics
Daniela Nunes, Ana Pimentel, Pedro Barquinha, et al.
Elsevier eBooks (2024), pp. 3-46
Closed Access
Improved fatigue resistance in transfer-printed flexible circuits embedded in polymer substrates with low melting temperatures
Thomas Chalklen, Michael Smith, Sohini Kar‐Narayan
Flexible and Printed Electronics (2023) Vol. 8, Iss. 2, pp. 025014-025014
Open Access | Times Cited: 1
Dynamics of Stress in Films of Metals on Silicon During Vacuum Heat Treatment
В. Н. Джуплин, V S Klimin, Yu. V. Morozova, et al.
Russian Microelectronics (2021) Vol. 50, Iss. 6, pp. 412-419
Closed Access | Times Cited: 2
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