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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Atomic-scale planarization surface of quartz glass induced by novel green chemical mechanical polishing using three ingredients
Dong Wang, Lu Liu, Zhenyu Zhang, et al.
Materials Today Sustainability (2024) Vol. 25, pp. 100669-100669
Closed Access | Times Cited: 24

Showing 24 citing articles:

Advanced polishing methods for atomic-scale surfaces: A review
Zhun Luo, Zhenyu Zhang, Feng Zhao, et al.
Materials Today Sustainability (2024) Vol. 27, pp. 100841-100841
Closed Access | Times Cited: 14
A review on the development of ceria for chemical mechanical polishing
Jiahui Ma, Ning Xu, Jie Cheng, et al.
Powder Technology (2024) Vol. 444, pp. 119989-119989
Closed Access | Times Cited: 10
Novel ceria/graphene oxide composite abrasives for chemical mechanical polishing
Chuandong Chen, Yanying Cui, Xiaopei Li, et al.
Ceramics International (2024) Vol. 50, Iss. 15, pp. 26325-26333
Closed Access | Times Cited: 9
Photocatalytic assisted chemical mechanical polishing for silicon carbide using developed ceria coated diamond core-shell abrasives
Xiaoxiao Zhu, Yuziyu Gui, Hao Fu, et al.
Tribology International (2024) Vol. 197, pp. 109827-109827
Closed Access | Times Cited: 9
Chemical mechanical polishing on cobalt-based barrier through dual functionality of salicylhydroxamic acid between the removal of copper and corrosion inhibition
Yingqi Di, Guofeng Pan, Song Lv, et al.
Electrochimica Acta (2025) Vol. 514, pp. 145689-145689
Closed Access
Characterizing the contact evolution through the combination of surface roughness parameters in chemical mechanical polishing using a polyurethane polishing pad
Jongmin Jeong, Yeongil Shin, Seunghun Jeong, et al.
Wear (2025), pp. 205802-205802
Closed Access
Recycling and Reuse of Rare Earth Polishing Powder Waste by a Simple Gravity Settling-Acid Leaching Process
X. Zhu, Xuesong Jiang, Juxuan Ding, et al.
Waste and Biomass Valorization (2025)
Closed Access
Preparation of SiO2@MnO2 composite abrasives and their performance in chemical-mechanical polishing of SiC substrates
Ruixing Yang, Hong Lei, Jianhua Zhang
Ceramics International (2024) Vol. 50, Iss. 19, pp. 34796-34805
Closed Access | Times Cited: 4
Chemical mechanical polishing of sapphire elucidated by densely discrete phase model and verified using atomic force microscopy
Mufang Zhou, Min Zhong, Wenhu Xu, et al.
Tribology International (2024) Vol. 197, pp. 109834-109834
Closed Access | Times Cited: 2
Quantitative analysis of the polishing performance of Wurtzite-SiC surface texture on surface quality and material removal rate
Tan-Tai Do, Phu-Cuong Le, Te‐Hua Fang
Tribology International (2024) Vol. 199, pp. 110020-110020
Closed Access | Times Cited: 2
Effect of synergistic CeO2/MoS2 abrasives on surface roughness and material removal rate of quartz glass
Gong Lv, Shengsheng Liu, Yuxi Cao, et al.
Ceramics International (2024)
Closed Access | Times Cited: 2
Atomic surface on fused silica induced by novel green photochemical mechanical polishing
Chunjing Shi, Zhenyu Zhang, Leilei Chen, et al.
Surfaces and Interfaces (2024) Vol. 54, pp. 105253-105253
Closed Access | Times Cited: 2
The influence of the types of cluster composite abrasives on the performance of fixed abrasive pads in processing quartz glass
Zhankui Wang, Pengzhan Wang, Xiaokun Wei, et al.
Materials Today Communications (2024) Vol. 39, pp. 108998-108998
Closed Access | Times Cited: 1
Lapping of sapphire using developed clusters of diamond and ceria chemically active abrasives
Zhankui Wang, Shangci Huang, Kuncheng Liu, et al.
Materials Today Communications (2024) Vol. 39, pp. 109386-109386
Closed Access | Times Cited: 1
Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution
Haoyu Du, Renhao Liu, Baimei Tan, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2024) Vol. 697, pp. 134428-134428
Closed Access | Times Cited: 1
Experimental study of ECDM using a porous electrode containing internal micropores
Linglei Kong, Lei Zhang, Weining Lei, et al.
Materials and Manufacturing Processes (2024) Vol. 39, Iss. 14, pp. 2020-2032
Closed Access | Times Cited: 1
Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism
X. Zhu, Juxuan Ding, Zhangchao Mo, et al.
Applied Surface Science (2024) Vol. 679, pp. 161157-161157
Closed Access | Times Cited: 1
Crystal structure transformation and lattice impurities migration of quartz during chlorine roasting
W. Guo, Lu Hong, Zhenyue Zhang, et al.
International Journal of Mining Science and Technology (2024)
Open Access | Times Cited: 1
Exploring the effectiveness of polyhydroxy complexing agents in sapphire chemical mechanical polishing: combining experiments and theoretical calculation
Xinjie Li, Yida Zou, Xinhuan Niu, et al.
Tribology International (2024) Vol. 199, pp. 110042-110042
Closed Access
Study on the polishing performance and mechanism of sapphire wafers by different types of degradable surfactants
Yongchao Xu, Cheng Peng, Ningchang Wang, et al.
Surfaces and Interfaces (2024) Vol. 52, pp. 104915-104915
Closed Access
Experimental Study of Key Factors on Super Smooth Surface Fabrication Upon Single Crystal Silicon Based on Mechanochemical Synergy
Xiao Shen, Xiaoyu Weng, Yancheng Li, et al.
Tribology International (2024) Vol. 201, pp. 110199-110199
Closed Access
Towards atomic-scale smooth surface manufacturing of β-Ga2O3 via highly efficient atmospheric plasma etching
Yongjie Zhang, Yuxi Xiao, Jianwen Liang, et al.
International Journal of Extreme Manufacturing (2024) Vol. 7, Iss. 1, pp. 015105-015105
Open Access
A novel green CeO2 polishing slurry and its chemical mechanical action mechanism for achieving atomic-level smoothing of fused silica glass surfaces
Fukun Li, Bai Yang, Haixiang Hu, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2024), pp. 135892-135892
Closed Access
Study of the impact of flake Al2O3 abrasive and N-n-Butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers
Zhanjie Du, Ru Wang, Xuhua Chen, et al.
Surfaces and Interfaces (2024), pp. 105626-105626
Closed Access
Zirconium and/or cerium-containing mesoporous silica as functional active abrasive particles for radical-facilitated chemical mechanical polishing
Zichen Tang, Yang Chen, Wenjin Zhou, et al.
Journal of Alloys and Compounds (2024), pp. 178090-178090
Closed Access
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