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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Low-temperature synthesis of copper conductivity film from a copper formate amine complex with a low boiling point
Akihiro Yabuki, Sayuri Kawahara, Soonchul Kang, et al.
Materials Science and Engineering B (2020) Vol. 262, pp. 114743-114743
Open Access | Times Cited: 13

Showing 13 citing articles:

Copper inks for printed electronics: a review
Xianghui Zeng, Pei He, Minglu Hu, et al.
Nanoscale (2022) Vol. 14, Iss. 43, pp. 16003-16032
Closed Access | Times Cited: 51
MODs vs. NPs: Vying for the Future of Printed Electronics
Samuel P. Douglas, Shreya Mrig, Caroline E. Knapp
Chemistry - A European Journal (2021) Vol. 27, Iss. 31, pp. 8062-8081
Open Access | Times Cited: 36
Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks
Nihesh Mohan, Juan Ignacio Ahuir‐Torres, Sri Krishna Bhogaraju, et al.
New Journal of Chemistry (2024) Vol. 48, Iss. 15, pp. 6796-6808
Closed Access | Times Cited: 4
Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink
Wendong Yang, Zihao Guo, Xun Zhao, et al.
Langmuir (2024) Vol. 40, Iss. 13, pp. 7095-7105
Closed Access | Times Cited: 3
Printing of passive RFID tag antennas on flexible substrates for long read distance applications: Materials and techniques
Mohd Nizar Hamidon, Tark D. Farnana, Intan Helina Hasan, et al.
Journal of Science Advanced Materials and Devices (2024) Vol. 9, Iss. 4, pp. 100778-100778
Open Access | Times Cited: 3
Superior anti-corrosion performance on Cu substrate achieved by dense polypropylene coating with ultrahigh inhibition efficiency deposited via the environmental-friendly method
Z.Q. Hu, Fuliang Ma, Luli Shen, et al.
Corrosion Science (2021) Vol. 191, pp. 109783-109783
Closed Access | Times Cited: 21
Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors
Yue Gao, Yu-bo Xiao, Zhi‐Quan Liu, et al.
Journal of Materials Science Materials in Electronics (2022) Vol. 33, Iss. 7, pp. 3576-3585
Closed Access | Times Cited: 8
Unraveling the Steric Link to Copper Precursor Decomposition: A Multi‐Faceted Study for the Printing of Flexible Electronics
Shreya Mrig, Malavika A. Bhide, Ye Zhou, et al.
Small Methods (2023) Vol. 7, Iss. 4
Open Access | Times Cited: 4
Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink
Tomoyuki Tachibana, Yuri Osaki, Ji Ha Lee, et al.
Current Applied Physics (2024) Vol. 66, pp. 81-87
Closed Access
Self-reducing copper paste with high conductivity and oxidation resistance for flexible substrate by intensive pulsed light sintering
Ruihan Lu, Wuchang Hao, Long Kong, et al.
Journal of Materials Science Materials in Electronics (2023) Vol. 34, Iss. 6
Closed Access | Times Cited: 1
Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics
Н. С. Шабанов, S. I. Suleymanov, А. М. Амиров, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 6, pp. 3215-3223
Closed Access | Times Cited: 1
Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics. II. The Solvent Effect
Н. С. Шабанов, А. М. Амиров, Abdulgalim B. Isaev, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 8, pp. 4635-4642
Closed Access | Times Cited: 1
Electrochemical reduction of carbon dioxide to C2 products using a copper-sulfide, nanoparticle electrode synthesized by thermal decomposition of sulfur and copper-amine complex ink
Akihiro Yabuki, Yuta Iwamura, Tomoyuki Tachibana, et al.
New Journal of Chemistry (2022) Vol. 46, Iss. 41, pp. 19633-19637
Closed Access | Times Cited: 2
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