OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Microwave hybrid heating for lead-free solder: A review
Mardiana Said, Nor Azmira Salleh, Muhammad Firdaus Mohd Nazeri, et al.
Journal of Materials Research and Technology (2023) Vol. 26, pp. 6220-6243
Open Access | Times Cited: 15

Showing 15 citing articles:

Vapour phase reflow soldering with vertical assembly stacking to improve productivity
Gergő Havellant, Balázs Illés, P. Kovács, et al.
Results in Engineering (2025), pp. 104414-104414
Open Access | Times Cited: 2

A review on heating mechanism, materials and heating parameters of microwave hybrid heated joining technique
Shuai Zhang, Qingyang Qiu, Chen Zeng, et al.
Journal of Manufacturing Processes (2024) Vol. 116, pp. 176-191
Closed Access | Times Cited: 15

Investigation on electromagnetic and heat transfer coupling of heating susceptor for selective microwave hybrid soldering: 3D multi-physics simulation and experiment
Shuai Zhang, Shaohua Qin, Wenqiang Wan, et al.
Applied Thermal Engineering (2024) Vol. 255, pp. 124047-124047
Closed Access | Times Cited: 6

Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints
Shuai Zhang, Hongzhi Zhou, Tianran Ding, et al.
Journal of Materials Research and Technology (2023) Vol. 28, pp. 1743-1751
Open Access | Times Cited: 15

Long-Term Dynamic Stability of the Interfacial Cu6Sn5 Texture in SAC305/Cu Joints by Laser Jet Solder Ball Bonding for Advanced Packaging
D. Liu, Tianyue Bai, Yuanyuan Qiao, et al.
ACS Applied Materials & Interfaces (2025)
Closed Access

Influence of Microwave Hybrid Heating on Soderability Performance of SAC305/Cu Solder Joints
Ezzatul Farhain Azmi, Abdullah Aziz Saad, Ahmad Azmin Mohamad
Springer proceedings in physics (2025), pp. 52-58
Closed Access

Research on the Influence of the Defects of Materials on Thermal Runaway in Microwave Hybrid Heating for Sintering Processes
Sorin Vasile Savu, Daniela Tarniţă, Iulian Ştefan, et al.
Applied Sciences (2025) Vol. 15, Iss. 8, pp. 4115-4115
Open Access

Impact of embedded susceptor mass and exposure time on morphological and property alterations in SAC305 joints using microwave hybrid heating
Shuai Zhang, Hongzhi Zhou, Tianran Ding, et al.
Materials Letters (2023) Vol. 357, pp. 135736-135736
Closed Access | Times Cited: 5

Microwave Hybrid Sintering and Soldering of Cu-Cr-W Composite Material for Reactive Power Breakers
Sorin Vasile Savu, Cristian Daniel Ghelsingher, Iulian Ştefan, et al.
Materials (2024) Vol. 17, Iss. 18, pp. 4648-4648
Open Access | Times Cited: 1

Accurate Simulation and Experimental Measurement of Water Heating Process by Microwave
Jia Song, Kama Huang, Chong Hai Xu, et al.
(2024)
Closed Access

Synthesis of calcium ferrite using microwave susceptor heating
Raj Kumar Kalshyan, Madan Mohanasundaram, G. M. Chowdhury, et al.
Canadian Metallurgical Quarterly (2024), pp. 1-11
Closed Access

Effect of Ultrasonic Bonding Process Conditions on IMC Growth Behavior of Sn58Bi/Cu Joints
Ye-Ji Heo, Euy-Sik Jeon, Jae‐Kyung Kim, et al.
Journal of the Korean Society of Manufacturing Process Engineers (2024) Vol. 23, Iss. 12, pp. 132-139
Closed Access

Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications
Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, et al.
Sains Malaysiana (2023) Vol. 52, Iss. 11, pp. 3261-3272
Open Access | Times Cited: 1

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