
OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures
Jianbo Xin, Yue Gao, Chenghao Zhang, et al.
Journal of Materials Processing Technology (2024) Vol. 329, pp. 118435-118435
Closed Access | Times Cited: 4
Jianbo Xin, Yue Gao, Chenghao Zhang, et al.
Journal of Materials Processing Technology (2024) Vol. 329, pp. 118435-118435
Closed Access | Times Cited: 4
Showing 4 citing articles:
Review of Die-Attach Materials for SiC HighTemperature Packaging
Fengze Hou, Zhanxing Sun, Meiying Su, et al.
IEEE Transactions on Power Electronics (2024) Vol. 39, Iss. 10, pp. 13471-13486
Closed Access | Times Cited: 4
Fengze Hou, Zhanxing Sun, Meiying Su, et al.
IEEE Transactions on Power Electronics (2024) Vol. 39, Iss. 10, pp. 13471-13486
Closed Access | Times Cited: 4
Effects of Fine Cu Particle Size on Sinter-Bondability in Die Bonding Using Cu Paste Possessing Effective Reducing Formulation
Horyun Kim, Jong‐Hyun Lee
Metals (2025) Vol. 15, Iss. 4, pp. 379-379
Open Access
Horyun Kim, Jong‐Hyun Lee
Metals (2025) Vol. 15, Iss. 4, pp. 379-379
Open Access
Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate
Zhicheng Wen, Wei Liu, Chunjin Hang, et al.
Journal of Materials Research and Technology (2024)
Open Access | Times Cited: 1
Zhicheng Wen, Wei Liu, Chunjin Hang, et al.
Journal of Materials Research and Technology (2024)
Open Access | Times Cited: 1
Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films
Jicun Lu, Xiaochun Lv, Chenghao Zhang, et al.
Micromachines (2024) Vol. 15, Iss. 12, pp. 1436-1436
Open Access
Jicun Lu, Xiaochun Lv, Chenghao Zhang, et al.
Micromachines (2024) Vol. 15, Iss. 12, pp. 1436-1436
Open Access