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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications
Zhijian Sun, Jiaxiong Li, Michael Yu, et al.
Chemical Engineering Journal (2022) Vol. 446, pp. 137319-137319
Closed Access | Times Cited: 84

Showing 1-25 of 84 citing articles:

Silver Nanoparticles: A Comprehensive Review of Synthesis Methods and Chemical and Physical Properties
Hatice Duman, Furkan Eker, Emir Akdaşçi, et al.
Nanomaterials (2024) Vol. 14, Iss. 18, pp. 1527-1527
Open Access | Times Cited: 34
Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation
Jun‐Wei Zha, Fan Wang, Baoquan Wan
Progress in Materials Science (2024) Vol. 148, pp. 101362-101362
Closed Access | Times Cited: 29
Near‐Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap‐Filling Adhesives
Lu Chen, Te‐Huan Liu, Xiangze Wang, et al.
Advanced Materials (2023) Vol. 35, Iss. 31
Closed Access | Times Cited: 33
Highly thermally conductive and negative permittivity epoxy composites by constructing the carbon fiber/carbon networks
Tao Jiang, Ying Wang, Kang Xu, et al.
Composites Communications (2023) Vol. 39, pp. 101560-101560
Closed Access | Times Cited: 31
Interfacial diffusion behavior and properties of hot-pressed Kovar/Cu composites
Ling Gao, Tao Meng, Guofu Xu, et al.
Materials Chemistry and Physics (2024) Vol. 315, pp. 128957-128957
Closed Access | Times Cited: 10
Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges
Yuhang Meng, Dehong Yang, Xiangfen Jiang, et al.
Nanomaterials (2024) Vol. 14, Iss. 4, pp. 331-331
Open Access | Times Cited: 9
Design and optimization of diamond-aluminum thermal spreading substrate for thermal management in high-power electronic devices
Haizhu Li, Zihan Ju, Qiang Li, et al.
Applied Thermal Engineering (2025), pp. 125662-125662
Closed Access | Times Cited: 1
Phase change fabrics based on paraffin@SiO2@Ag microcapsules for temperature response and thermoregulation
Ziyu Liu, Huanrui Liu, Daofu Zhang, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2025), pp. 136285-136285
Closed Access | Times Cited: 1
Thermal expansivity of polymer nanocomposites and applications
Christopher Igwe Idumah
Polymer-Plastics Technology and Materials (2023) Vol. 62, Iss. 9, pp. 1178-1203
Closed Access | Times Cited: 20
Review of thermal conductivity in epoxy thermosets and composites: Mechanisms, parameters, and filler influences
Meihui Zhou, Guang‐Zhong Yin, S.G. Prolongo
Advanced Industrial and Engineering Polymer Research (2023) Vol. 7, Iss. 3, pp. 295-308
Open Access | Times Cited: 19
Polymer‐based nanocomposites in semiconductor packaging
Tengyu Li, Peng Li, Rong Sun, et al.
IET Nanodielectrics (2023) Vol. 6, Iss. 3, pp. 147-158
Open Access | Times Cited: 17
Characterisation, slow-release, and antibacterial properties of carboxymethyl chitosan/inulin hydrogel film loaded with novel antilisterial durancin GL
Debao Wang, Lihui Du, Zhilan Sun, et al.
Carbohydrate Polymers (2023) Vol. 318, pp. 121143-121143
Closed Access | Times Cited: 17
Construction of three-dimensional interconnected boron nitride/sliver networks within epoxy composites for enhanced thermal conductivity
Xudong Wu, Haojie Yu, Li Wang, et al.
Composites Science and Technology (2023) Vol. 243, pp. 110268-110268
Closed Access | Times Cited: 17
A smart insulation material achieving self-reporting and autonomous repairing against electrical and mechanical damages based on targeted controllable microcapsules
Wenlong Pang, Wenxia Sima, Potao Sun, et al.
Composites Part A Applied Science and Manufacturing (2024) Vol. 185, pp. 108299-108299
Closed Access | Times Cited: 7
Preparation of graphitic foil with high thermal conductivity using Vitamin C as reductant and binder
Sufang Yang, Zechao Tao, Qingqiang Kong, et al.
Chemical Engineering Journal (2023) Vol. 473, pp. 145330-145330
Closed Access | Times Cited: 15
Enhanced thermal conductivity of a superhydrophobic thermal energy storage coating based on artificially cultured diatom frustules
Dandan Li, Haoyang Sun, Tao Li, et al.
Applied Energy (2023) Vol. 347, pp. 121462-121462
Closed Access | Times Cited: 13
Thermally conductive silver adhesive enhanced by MXene@AgNPs with excellent thermal conductivity for thermal management applications
Li Liu, Tao Chen, Han Liu, et al.
Applied Surface Science (2024) Vol. 672, pp. 160787-160787
Closed Access | Times Cited: 5
Enhanced mechanical, thermal properties and thermal conductivities of epoxy composites via incorporating graphene oxide‐grafted carbon nanotubes hybrids
Song Liu, Jingshan Zhang, Xiangying Fan, et al.
Polymer Composites (2024)
Closed Access | Times Cited: 5
Effects of interface bonding on the macro-mechanical properties of microcapsule/epoxy resin composites
Guijing Dou, Guangjian Peng, Yahao Hu, et al.
Surfaces and Interfaces (2022) Vol. 34, pp. 102310-102310
Closed Access | Times Cited: 20
Development and Perspectives of Thermal Conductive Polymer Composites
Jiaqi Wang, Lin Hu, Wenhao Li, et al.
Nanomaterials (2022) Vol. 12, Iss. 20, pp. 3574-3574
Open Access | Times Cited: 20
Emerging advances in thermal conductivity of polymeric nanoarchitectures
Christopher Igwe Idumah
Polymer-Plastics Technology and Materials (2023) Vol. 62, Iss. 14, pp. 1878-1911
Closed Access | Times Cited: 11
Research on molecular dynamics and electrical properties of high heat-resistant epoxy resins
Changhai Zhang, Zeyang Liu, Xubin Wang, et al.
The Journal of Chemical Physics (2024) Vol. 160, Iss. 9
Closed Access | Times Cited: 4
Thioester-Based Latent Curing Agent for Thermally Conductive Epoxy Composites
Jinju Kim, G.T. Kim, Jeehoon Kim, et al.
ACS Applied Polymer Materials (2024) Vol. 6, Iss. 8, pp. 4568-4578
Closed Access | Times Cited: 4
One-step functionalization of chitosan with rich sulfur and nitrogen adsorption sites for efficient recovery of silver ions from actual wastewater
Manying Zhu, Dawei Xiang, Shuai Wang, et al.
International Journal of Biological Macromolecules (2024) Vol. 276, pp. 134000-134000
Closed Access | Times Cited: 4
Interphase investigation of modified McLachlan model and the 3D finite element method for electrical conductivity
Muhammad Zulkarnain, Irianto Irianto, Amir Abdullah Muhamad Damanhuri
Heliyon (2025) Vol. 11, Iss. 1, pp. e41621-e41621
Open Access
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