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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance
Wenwu Zhang, Yan-Hong Zhou, Yiping Ding, et al.
Applied Surface Science (2022) Vol. 586, pp. 152691-152691
Closed Access | Times Cited: 31

Showing 1-25 of 31 citing articles:

Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion
Amnani Abu Bakar, Norazlina Hashim, Hairul Anuar Tajuddin, et al.
Current Applied Physics (2025) Vol. 71, pp. 138-143
Closed Access | Times Cited: 1
Research on the enhancement of densification and electrical conductivity of silver-coated copper conductive films via oxidation–reduction sintering method
Xuewen Wang, Jie Zhao, Qingwen Shi, et al.
Journal of Materials Science (2025)
Closed Access | Times Cited: 1
Impact of particle size and additives on the sintering behavior of Cu@Ag pastes
Miso Won, Dajung Kim, Hyun-Seung Yang, et al.
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 4
Closed Access | Times Cited: 1
The anti-electrochemical migration mechanism of Ag-based transient Liquid-Phase electrically conductive Adhesive: Experimental and phase-field study
Shuang Zhao, Mingkun Yang, Yingxia Liu, et al.
Applied Surface Science (2025), pp. 162998-162998
Closed Access | Times Cited: 1
Enhancing morphology and conductivity of silver layers for microstrip antennas via near-infrared sintering in additive manufacturing
Zhiguang Xu, Jizhuang Hui, Jingxiang Lv, et al.
Applied Surface Science (2025), pp. 162542-162542
Closed Access
Streamlined Approach for Covalently Anchoring End-Functionalised Cationic Monolayers Onto Silver Substrates for Surface Coatings
Amnani Abu Bakar, Nor Haslina Hashim, Hairul Anuar Tajuddin, et al.
(2025)
Closed Access
Preparation of graphene-coated Cu particles with oxidation resistance by flash joule heating
Congli Zhou, Fangzhu Qing, Xiao Sun, et al.
Carbon (2024) Vol. 224, pp. 119060-119060
Closed Access | Times Cited: 4
Fabrication of Electronics by Electrohydrodynamic Jet Printing
Haihua Zhou, Yanlin Song
Advanced Electronic Materials (2022) Vol. 8, Iss. 11
Closed Access | Times Cited: 18
Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances
Xingwen Zhou, Wei Guo, Qian Sun, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 7, pp. 3780-3789
Closed Access | Times Cited: 10
Insight into the shell-dependent sintering behavior of Cu-Ag core–shell nanoparticle from molecular dynamics simulation
Zhonghua Zhang, Shizhen Li, Yang Liu
Journal of Materials Science (2023) Vol. 58, Iss. 32, pp. 13059-13079
Open Access | Times Cited: 10
Structure and Stability of Core–Shell Cu–Pt Nanoparticles for Catalytic Applications
Alexandre C. Foucher, Daniel J. Rosen, Lucy K. Decker, et al.
Chemistry of Materials (2023) Vol. 35, Iss. 20, pp. 8758-8764
Closed Access | Times Cited: 9
Structure and plastic deformation of metastable Ag–Cu metal-matrix composites produced by a bottom-up way from Cu@Ag core–shell powders
Angelina Strakošová, Drahomír Dvorský, Filip Průša, et al.
Journal of Materials Science (2024) Vol. 59, Iss. 31, pp. 14728-14746
Open Access | Times Cited: 3
One-step electrodeposition to fabricate superhydrophobic surfaces on flexible conductive films: Optimization of metallic compounds
Hongyuan He, Jiebin Du, Zhangzhao Weng, et al.
Materials Today Communications (2023) Vol. 35, pp. 105492-105492
Closed Access | Times Cited: 7
Surface modification of Ag-coated Cu particles using dicarboxylic acids to enhance the electrical conductivity of sintered films by suppressing dewetting in Ag shells
Yeongjung Kim, Eun Byeol Choi, Jong‐Hyun Lee
Applied Surface Science (2023) Vol. 640, pp. 158326-158326
Closed Access | Times Cited: 7
Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging
Bolong Zhou, Qiang Jia, Yishu Wang, et al.
Journal of Laser Applications (2024) Vol. 36, Iss. 2
Open Access | Times Cited: 2
Mini-review on laser-induced nanoparticle heating and melting
Ilya V. Baimler, Alexander V. Simakin, Alexey S. Dorokhov, et al.
Frontiers in Chemistry (2024) Vol. 12
Open Access | Times Cited: 2
Sintering dynamic evolution and enhancement mechanism of nano-Cu/boron nitride composite matrix with excellent mechanical properties from the atomic perspective
Weishan Lv, Jianwei Lv, Jiaxin Liu, et al.
Composite Structures (2024) Vol. 354, pp. 118756-118756
Closed Access | Times Cited: 2
Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics
Zhuohuan Wu, Wei Liu, Jiayun Feng, et al.
ACS Omega (2023) Vol. 8, Iss. 34, pp. 31021-31029
Open Access | Times Cited: 6
Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders
Fei Han, Mei Cao, Jiali Lin, et al.
Materials Science and Technology (2024)
Closed Access | Times Cited: 1
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles
Liyun Li, Yu Zhang, Shiyu Xia, et al.
Microelectronics International (2023) Vol. 40, Iss. 2, pp. 132-139
Closed Access | Times Cited: 4
Three-stage synthesis and characterization of bimetallic Ag/Cu/Cu2O nanoparticles for antimicrobial applications
О. В. Алексеева, Н. Р. Вохидова, V. D. Shibaeva, et al.
Materials Science and Engineering B (2023) Vol. 299, pp. 116984-116984
Closed Access | Times Cited: 4
Copper Sintering Pastes with Various Polar Solvents and Acidic Activators
Seung-yeon Lee, Seong-ju Han, Yongjune Kim, et al.
ACS Omega (2023) Vol. 8, Iss. 42, pp. 39135-39142
Open Access | Times Cited: 3
Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications
Fengyi Wang, Xinjie Wang, Xingchao Mao, et al.
Journal of Materials Research and Technology (2022) Vol. 21, pp. 4490-4499
Open Access | Times Cited: 3
Electrical and mechanical performance of Inkjet-printed flexible electrodes based on reduced graphene oxide/silver nanoparticles
H. Ismail, Nora’zah Abdul Rashid, Syed Muhammad Hafiz Syed Mohd Jaafar, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 35, Iss. 7
Closed Access
Design of hybrid Ag–Au nanostructure based fully elastomeric nanocomposite electrodes for soft integrated electronics
Seongsik Jeong, Hyeseon Jo, Donghyeon Seo, et al.
Composites Part B Engineering (2024) Vol. 281, pp. 111516-111516
Closed Access
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