
OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review
Tongwha Kim, Kamran Behdinan
Journal of Intelligent Manufacturing (2022) Vol. 34, Iss. 8, pp. 3215-3247
Closed Access | Times Cited: 54
Tongwha Kim, Kamran Behdinan
Journal of Intelligent Manufacturing (2022) Vol. 34, Iss. 8, pp. 3215-3247
Closed Access | Times Cited: 54
Showing 1-25 of 54 citing articles:
Progress, challenges and trends on vision sensing technologies in automatic/intelligent robotic welding: State-of-the-art review
Qiang Guo, Zi Jian Yang, Jinting Xu, et al.
Robotics and Computer-Integrated Manufacturing (2024) Vol. 89, pp. 102767-102767
Closed Access | Times Cited: 38
Qiang Guo, Zi Jian Yang, Jinting Xu, et al.
Robotics and Computer-Integrated Manufacturing (2024) Vol. 89, pp. 102767-102767
Closed Access | Times Cited: 38
An unknown wafer surface defect detection approach based on Incremental Learning for reliability analysis
Zeyun Zhao, Jia Wang, Qian Tao, et al.
Reliability Engineering & System Safety (2024) Vol. 244, pp. 109966-109966
Closed Access | Times Cited: 27
Zeyun Zhao, Jia Wang, Qian Tao, et al.
Reliability Engineering & System Safety (2024) Vol. 244, pp. 109966-109966
Closed Access | Times Cited: 27
Collaborative task of entity and relation recognition for developing a knowledge graph to support knowledge reasoning for design for additive manufacturing
Auwal Haruna, Maolin Yang, Pingyu Jiang, et al.
Advanced Engineering Informatics (2024) Vol. 60, pp. 102364-102364
Closed Access | Times Cited: 8
Auwal Haruna, Maolin Yang, Pingyu Jiang, et al.
Advanced Engineering Informatics (2024) Vol. 60, pp. 102364-102364
Closed Access | Times Cited: 8
Review of Wafer Surface Defect Detection Methods
MA Jian-hong, Tao Zhang, Cong Yang, et al.
Electronics (2023) Vol. 12, Iss. 8, pp. 1787-1787
Open Access | Times Cited: 16
MA Jian-hong, Tao Zhang, Cong Yang, et al.
Electronics (2023) Vol. 12, Iss. 8, pp. 1787-1787
Open Access | Times Cited: 16
Designing semiconductor materials and devices in the post-Moore era by tackling computational challenges with data-driven strategies
Jiahao Xie, Yansong Zhou, Muhammad Faizan, et al.
Nature Computational Science (2024) Vol. 4, Iss. 5, pp. 322-333
Closed Access | Times Cited: 5
Jiahao Xie, Yansong Zhou, Muhammad Faizan, et al.
Nature Computational Science (2024) Vol. 4, Iss. 5, pp. 322-333
Closed Access | Times Cited: 5
DMWMNet: A novel dual-branch multi-level convolutional network for high-performance mixed-type wafer map defect detection in semiconductor manufacturing
Xiangyan Zhang, Zhong Jiang, Hong Yang, et al.
Computers in Industry (2024) Vol. 161, pp. 104136-104136
Closed Access | Times Cited: 5
Xiangyan Zhang, Zhong Jiang, Hong Yang, et al.
Computers in Industry (2024) Vol. 161, pp. 104136-104136
Closed Access | Times Cited: 5
A framework for detecting unknown defect patterns on wafer bin maps using active learning
Jin-Su Shin, Min-Joo Kim, Dong‐Hee Lee
Expert Systems with Applications (2024), pp. 125378-125378
Closed Access | Times Cited: 5
Jin-Su Shin, Min-Joo Kim, Dong‐Hee Lee
Expert Systems with Applications (2024), pp. 125378-125378
Closed Access | Times Cited: 5
Large scale foundation models for intelligent manufacturing applications: a survey
Haotian Zhang, Stuart Dereck Semujju, Zhicheng Wang, et al.
Journal of Intelligent Manufacturing (2025)
Open Access
Haotian Zhang, Stuart Dereck Semujju, Zhicheng Wang, et al.
Journal of Intelligent Manufacturing (2025)
Open Access
Global feature identification layer for mixed-type wafer bin map classification
Jaehyeon Joo, Chang Ouk Kim
Expert Systems with Applications (2025), pp. 126709-126709
Closed Access
Jaehyeon Joo, Chang Ouk Kim
Expert Systems with Applications (2025), pp. 126709-126709
Closed Access
Global context enhanced resolution networks for sapphire scratch detection and classification
Guobao Zhao, Yuhang Lin, Xi Zheng, et al.
Optics & Laser Technology (2025) Vol. 184, pp. 112522-112522
Closed Access
Guobao Zhao, Yuhang Lin, Xi Zheng, et al.
Optics & Laser Technology (2025) Vol. 184, pp. 112522-112522
Closed Access
SR-FABNet: Super-Resolution branch guided Fourier attention detection network for efficient optical inspection of nanoscale wafer defects
Leisheng Chen, Kai Meng, Hangying Zhang, et al.
Advanced Engineering Informatics (2025) Vol. 65, pp. 103200-103200
Closed Access
Leisheng Chen, Kai Meng, Hangying Zhang, et al.
Advanced Engineering Informatics (2025) Vol. 65, pp. 103200-103200
Closed Access
Sequential wafer map inspection via feedback loop with reinforcement learning
Aleksandr Dekhovich, Oleg Soloviev, Michel Verhaegen
Expert Systems with Applications (2025), pp. 126996-126996
Open Access
Aleksandr Dekhovich, Oleg Soloviev, Michel Verhaegen
Expert Systems with Applications (2025), pp. 126996-126996
Open Access
Casting-DETR: An End-to-End Network for Casting Surface Defect Detection
Quancheng Pu, Hui Zhang, Xiangrong Xu, et al.
International Journal of Metalcasting (2024) Vol. 18, Iss. 4, pp. 3152-3165
Closed Access | Times Cited: 4
Quancheng Pu, Hui Zhang, Xiangrong Xu, et al.
International Journal of Metalcasting (2024) Vol. 18, Iss. 4, pp. 3152-3165
Closed Access | Times Cited: 4
Large-Margin Extreme Learning Machines With Hybrid Features for Wafer Map Defect Recognition
Zhengkun Yi, Wanfeng Shang, Dong Wang, et al.
IEEE Transactions on Instrumentation and Measurement (2024) Vol. 73, pp. 1-10
Closed Access | Times Cited: 4
Zhengkun Yi, Wanfeng Shang, Dong Wang, et al.
IEEE Transactions on Instrumentation and Measurement (2024) Vol. 73, pp. 1-10
Closed Access | Times Cited: 4
MFSF-Net: A Multiscale Feature and Side-Outputs Fusion Network for Pixelwise Catastrophic Optical Damage Detection
Shuai Guo, Dengao Li, Jumin Zhao, et al.
IEEE Transactions on Instrumentation and Measurement (2024) Vol. 73, pp. 1-10
Closed Access | Times Cited: 3
Shuai Guo, Dengao Li, Jumin Zhao, et al.
IEEE Transactions on Instrumentation and Measurement (2024) Vol. 73, pp. 1-10
Closed Access | Times Cited: 3
A full-flow inspection method based on machine vision to detect wafer surface defects
Naigong Yu, Wanqing Li, Qiao Xu
Mathematical Biosciences & Engineering (2023) Vol. 20, Iss. 7, pp. 11821-11846
Open Access | Times Cited: 8
Naigong Yu, Wanqing Li, Qiao Xu
Mathematical Biosciences & Engineering (2023) Vol. 20, Iss. 7, pp. 11821-11846
Open Access | Times Cited: 8
Learning from single-defect wafer maps to classify mixed-defect wafer maps
Jaewoong Shim, Seokho Kang
Expert Systems with Applications (2023) Vol. 233, pp. 120923-120923
Closed Access | Times Cited: 8
Jaewoong Shim, Seokho Kang
Expert Systems with Applications (2023) Vol. 233, pp. 120923-120923
Closed Access | Times Cited: 8
Wafer map defect recognition based on multi-scale feature fusion and attention spatial pyramid pooling
Shouhong Chen, Zhentao Huang, Tao Wang, et al.
Journal of Intelligent Manufacturing (2023)
Closed Access | Times Cited: 8
Shouhong Chen, Zhentao Huang, Tao Wang, et al.
Journal of Intelligent Manufacturing (2023)
Closed Access | Times Cited: 8
Machine vision-based recognition of elastic abrasive tool wear and its influence on machining performance
Lei Guo, Zhengcong Duan, Wanjin Guo, et al.
Journal of Intelligent Manufacturing (2023) Vol. 35, Iss. 8, pp. 4201-4216
Closed Access | Times Cited: 7
Lei Guo, Zhengcong Duan, Wanjin Guo, et al.
Journal of Intelligent Manufacturing (2023) Vol. 35, Iss. 8, pp. 4201-4216
Closed Access | Times Cited: 7
Fault identification of product design using fuzzy clustering generative adversarial network (FCGAN) model
Yuyang Wang, Qiaowei Xue
Soft Computing (2024) Vol. 28, Iss. 4, pp. 3725-3742
Closed Access | Times Cited: 2
Yuyang Wang, Qiaowei Xue
Soft Computing (2024) Vol. 28, Iss. 4, pp. 3725-3742
Closed Access | Times Cited: 2
Generalized zero-shot learning for classifying unseen wafer map patterns
Han Kyul Kim, Jaewoong Shim
Engineering Applications of Artificial Intelligence (2024) Vol. 133, pp. 108476-108476
Closed Access | Times Cited: 2
Han Kyul Kim, Jaewoong Shim
Engineering Applications of Artificial Intelligence (2024) Vol. 133, pp. 108476-108476
Closed Access | Times Cited: 2
Sample-imbalanced wafer map defects classification based on auxiliary classifier denoising diffusion probability model
Jialin Li, Ran Tao, Renxiang Chen, et al.
Computers & Industrial Engineering (2024) Vol. 192, pp. 110209-110209
Closed Access | Times Cited: 2
Jialin Li, Ran Tao, Renxiang Chen, et al.
Computers & Industrial Engineering (2024) Vol. 192, pp. 110209-110209
Closed Access | Times Cited: 2
Efficient Mixed-Type Wafer Defect Pattern Recognition Based on Light-Weight Neural Network
Guangyuan Deng, Hongcheng Wang
Micromachines (2024) Vol. 15, Iss. 7, pp. 836-836
Open Access | Times Cited: 2
Guangyuan Deng, Hongcheng Wang
Micromachines (2024) Vol. 15, Iss. 7, pp. 836-836
Open Access | Times Cited: 2
Similarity searching for wafer bin maps by measuring shape, location, and size similarities of defect patterns
Min‐Su Kang, Jin-Su Shin, Dong‐Hee Lee
Computers & Industrial Engineering (2024) Vol. 196, pp. 110486-110486
Closed Access | Times Cited: 2
Min‐Su Kang, Jin-Su Shin, Dong‐Hee Lee
Computers & Industrial Engineering (2024) Vol. 196, pp. 110486-110486
Closed Access | Times Cited: 2
An Attention-Augmented Convolutional Neural Network With Focal Loss for Mixed-Type Wafer Defect Classification
Uzma Batool, Mohd Ibrahim Shapiai, Salama A. Mostafa, et al.
IEEE Access (2023) Vol. 11, pp. 108891-108905
Open Access | Times Cited: 5
Uzma Batool, Mohd Ibrahim Shapiai, Salama A. Mostafa, et al.
IEEE Access (2023) Vol. 11, pp. 108891-108905
Open Access | Times Cited: 5