OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy
Zhoudong Yang, Xinyue Wang, Wei Chen, et al.
Laser & Photonics Review (2024) Vol. 18, Iss. 7
Closed Access | Times Cited: 6
Zhoudong Yang, Xinyue Wang, Wei Chen, et al.
Laser & Photonics Review (2024) Vol. 18, Iss. 7
Closed Access | Times Cited: 6
Showing 6 citing articles:
Stress-Induced Cracks in Triangular Defects of Thick 4H-SiC Homoepitaxial Layers
Siqi Zhao, Yunkai Li, Moyu Wei, et al.
Vacuum (2025), pp. 114077-114077
Closed Access
Siqi Zhao, Yunkai Li, Moyu Wei, et al.
Vacuum (2025), pp. 114077-114077
Closed Access
Defect evolution and color center generation of high energy density femtosecond laser processed IIa diamond
Bing Dong, Qingqing Sun, Jianshi Wang, et al.
Nanotechnology and Precision Engineering (2025) Vol. 8, Iss. 4
Open Access
Bing Dong, Qingqing Sun, Jianshi Wang, et al.
Nanotechnology and Precision Engineering (2025) Vol. 8, Iss. 4
Open Access
A Critical Comparison Among High-Resolution Methods for Spatially Resolved Nano-Scale Residual Stress Analysis in Nanostructured Coatings
Saqib Rashid, Edoardo Rossi, Spyros Diplas, et al.
International Journal of Molecular Sciences (2025) Vol. 26, Iss. 7, pp. 3296-3296
Open Access
Saqib Rashid, Edoardo Rossi, Spyros Diplas, et al.
International Journal of Molecular Sciences (2025) Vol. 26, Iss. 7, pp. 3296-3296
Open Access
Raman Investigation on Silicon Nitride Chips after Soldering onto Copper Substrates
Claudia Mezzalira, Fosca Conti, Danilo Pedron, et al.
Micromachines (2024) Vol. 15, Iss. 8, pp. 990-990
Open Access | Times Cited: 1
Claudia Mezzalira, Fosca Conti, Danilo Pedron, et al.
Micromachines (2024) Vol. 15, Iss. 8, pp. 990-990
Open Access | Times Cited: 1
Prediction of Temperature‐Dependent Stress in 4H‐SiC Using In Situ Nondestructive Raman Spectroscopy Characterization
Zhoudong Yang, Xinyue Wang, Yuanhui Zuo, et al.
Laser & Photonics Review (2024)
Closed Access
Zhoudong Yang, Xinyue Wang, Yuanhui Zuo, et al.
Laser & Photonics Review (2024)
Closed Access
Effect of bonding defects on heat transfer and creep response of microprocessor-heatsink adhesive joints
V. Gutiérrez-Posada, A. Akhavan‐Safar, Beatriz D. Simões, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 36, Iss. 1
Open Access
V. Gutiérrez-Posada, A. Akhavan‐Safar, Beatriz D. Simões, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 36, Iss. 1
Open Access
